Method and apparatus for a deployable radio-frequency identification portal system

ABSTRACT

An apparatus for interrogating radio-frequency identification (RFID) tags within an enclosure. In an embodiment, the apparatus comprises an RFID module, a first assembly comprising a processor, a second assembly comprising an RFID radiator operatively coupled to the RFID module, and a connection element coupled to the first assembly and second assembly such that the second assembly is movable relative to the first assembly between a first configuration and second configuration. The processor may be configured to interrogate RFID tags via the RFID module and RFID radiator when the second assembly is in the second configuration, and not interrogate RFID tags when the second assembly is in the first configuration. In addition, both the first assembly and the second assembly may comprise attachment components configured to removably couple its respective assembly to one or more surfaces of an enclosure.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/611,636, filed on Feb. 2, 2015, and entitled “METHOD AND APPARATUSFOR A DEPLOYABLE RADIO-FREQUENCY IDENTIFICATION PORTAL SYSTEM,” which isa continuation of U.S. patent application Ser. No. 12/432,189, filed onApr. 29, 2009, and entitled “METHOD AND APPARATUS FOR A DEPLOYABLERADIO-FREQUENCY IDENTIFICATION PORTAL SYSTEM”, which claims priority toU.S. Provisional Patent App. No. 61/048,901, filed on Apr. 29, 2008, andentitled “METHOD AND APPARATUS FOR A DEPLOYABLE RADIO FREQUENCYIDENTIFICATION SYSTEM,” the entireties of which are hereby incorporatedherein by reference.

BACKGROUND

Embodiments relate generally to radio-frequency identification (RFID)portal systems, and, in particular, to methods and apparatus for adeployable RFID portal system.

RFID portal systems have been deployed historically using expensive,permanently wall-mounted commercial off-the-shelf (COTS) hardware. Thisapproach is convenient in the context of a static distribution center,for example, where wall power and Ethernet access are relatively cheapand available. The RFID technology, however, often used within, forexample, the confines of a non-static distribution center fails toaddress the requirements of an environment that is remote, austere,and/or mobile.

A few examples of such environments include but are not limited to the“last tactical mile” of military operations and transcontinentalcommercial shipping operations. Often, the US military is unable to usemission critical assets simply because they cannot be found in a timelymanner. Additionally, logistics companies responsible for shippingproducts from one country to another lack the level of shippingverification and visibility needed to track and trace shipmentseffectively. Accordingly, methods and apparatus are needed to addressthe shortfalls of known systems. For example, a need exists for methodsand apparatus for semi-mobile applications where the infrastructure doesnot move relative to the enclosure (e.g., container), but the enclosureitself may travel great distances.

SUMMARY

In one embodiment, an apparatus includes a first assembly, a secondassembly, and a coupling element coupled to the first assembly and thesecond assembly. The first assembly includes a processor, a memory, anda radiator module, the processor operatively coupled to the memory andthe radiator module. The second assembly includes a radiator operativelycoupled to the radiator module. The second assembly is movable relativeto the first assembly about the coupling element between a firstconfiguration and a second configuration. The processor is configured tointerrogate a radio-frequency identification module via the radiatormodule and the radiator when the second assembly is in the secondconfiguration.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram that illustrates a deployable inventoryingsystem (DIS) that includes at least one body and may include at leastone wing, according to an embodiment.

FIG. 2 is a schematic diagram that illustrates the DIS of FIG. 1 in adeployed state, according to an embodiment.

FIG. 3 is a schematic diagram illustrating one version of the componentsof a DIS, according to an embodiment.

FIG. 4 illustrates one embodiment of a wing assembly, according to anembodiment.

FIG. 5 is a top-down transparent view of an attach/release wingconnection, according to an embodiment.

FIG. 6A illustrates an upper portion of a low-profile wing assembly, and6B illustrates portions of the low-profile wing assembly, according toan embodiment.

FIG. 7 illustrates a cross-sectional view of an attachment device,according to an embodiment.

FIG. 8 is a schematic diagram that illustrates a cross-sectional view amodification to a rivet clincher, according to an embodiment.

FIG. 9 is a flowchart that illustrates a method for installing a DIS inat least a portion of an enclosure, according to an embodiment.

FIG. 10 is a schematic diagram of at least some connections within aDIS, according to an embodiment.

FIG. 11 is a schematic diagram of at least some connections within aDIS, according to an embodiment.

FIGS. 12A, 12B and 12C illustrate the installation of one embodiment ofthe DIS, according to an embodiment.

FIG. 13 illustrates the simulation of RF energy generate in oneembodiment of the DIS.

FIG. 14 is schematic diagram that illustrates an array of wings operablycoupled to a body of a DIS, according to an embodiment.

FIG. 15 illustrates various communication paths for communicating datacaptured from a DIS, according to an embodiment.

FIG. 16 is a flowchart of a process for interrogating an RFID modulewith a DIS, according to an embodiment.

DETAILED DESCRIPTION

One or more embodiments relate to methods and apparatus for rapidlydeployable inventorying systems (“DIS”). When deployed (also can bereferred to as installed) within an enclosure, the enclosure can bereferred to as a self-inventorying enclosure system (“SIES”). A DIS canbe configured to identify the contents of a SIES (e.g., shippingcontainer, barrel, box, crate, vending machine, server rack, etc.)without human intervention by combining passive, semi-passive,semi-active, and/or active radio-frequency identification (“RFID”)technology with data communications technologies and managementsoftware.

Some embodiments of DIS technology allow for object identification at adistance and out-of-line of sight. Such embodiments can includetransponders called radio-frequency (“RF”) tags or RFID tags (also canbe referred to as “RF tag modules,” “RFID tag modules,” “RF modules,” or“RFID modules”) and RF interrogators (also can be referred to as “RFIDreaders” or “readers”). RF tags (or RF tag modules, RFID tag modules, RFmodules, and RFID modules) can include RF tags separate from otherdevices or circuitry and/or RF tags included with or coupled toadditional circuitry. The RF tags can be smaller, sometimes as small asa grain of rice, sometimes less expensive than interrogators, and can beattached to, for example, objects such as product packages in stores.When an interrogator is within range of an RF tag and when theinterrogator is activated, the interrogator may provide power to the tagvia a querying signal. Sending an RF tag a querying signal can also bereferred to as interrogating the RF tag. In some embodiments, the RF tagcan use stored power from a battery or a capacitor, or from other powerstorage or power harvesting devices, components, or systems, to send aradio-frequency signal to be read by the RFID interrogator. In someembodiments, interrogating an RF tag can include sending a queryingsignal to an RF tag and receiving a signal (or interrogation response)from the RF tag.

RF tags can include a single integrated circuit, circuits, and/orantennas (also can be referred to as a radiator). Some RF tags may beconfigured to compute one or more values, store data, and sense varioussignals and/or environmental conditions using a sensor. Some categoriesof RFID tags include the following: passive tags that acquire power viathe electromagnetic field emitted by the interrogator; semi-passive tagsthat respond similarly, but also use on-board stored power for otherfunctions; active tags that use their own stored power to respond to aninterrogator's signal; inductively coupled tags that operate at shortdistances via a coil antenna; single or dual dipole antenna-equippedtags that operate at relatively high frequencies and long distances;read-write tags that can alter data stored upon them; full-duplex orhalf duplex tags; collision arbitration tags that may be read in groups;non-collision tags that are read individually; Ultra-Widebandcarrier-free, baseband, or impulse (e.g., short pulse electromagnetic)tags; and/or a radio wave pulse that is directly converted into ananoscale surface acoustic wave (“SAW”) on the SAW chip surface.

DIS technology can have a number of advantages over some object markingand tracking systems. A radio-frequency interrogator associated with aDIS may be able to read a tag when it is not in line of sight from theinterrogator, when the tag is dirty, or when an enclosure obscures thetag. A DIS system can be configured to identify objects at greaterdistances than optical systems, can store information into read/writetags, need not require a human operator, and/or can be configured toread tags hidden from visual inspection for security purposes. Theseadvantages make a DIS useful for, for example, tracking objects.

DIS technology can be less expensive to implement than conventional datacapture methods that do not involve RFID technology. The DIS can beconfigured to use passive tags that may be very low cost per unit,facilitating widespread use. DIS can be used in a shipping and/orwarehousing environment with large enclosures on pallets, which oftencontain nested enclosures, and/or inexpensive passive tags on individualobjects. DIS can also use active tags, which have greater range and arepractical in many instances because of cost and shelf life. A DIS canuse multiple tag types for groups of objects in potentially mobileenclosures. The DIS can be configured to deliver a high read rate undera variety of conditions, at a distance, and at a reasonable costrelative to a stationary RFID system. A DIS can be configured to becompatible with a variety of environments and tag types.

In some embodiments of the DIS, the DIS can include one or more wingassemblies that can include one or more radiators (e.g., antenna). Insome embodiments of the DIS, master wings may communicate with anotherassembly of the DIS such as a control assembly through wired or wirelesscommunications. Internal wireless communications methods can include,but are not limited to Bluetooth, 802.1x (e.g., 802.11a, 802.11b,802.11g, 802.11n, 802.15), Wireless USB, Dedicated Short RangeCommunications (“DSRC”), Ultra-Wideband (“UWB”), and infrared. In someembodiments of the DIS, all or substantially all outside communicationsdevices may be turned off, disconnected, or removed, depending on enduser requirements, to facilitate secure tracking without potentialinterference, interaction, or data modification, from external sourceswithout the originators knowledge and/or permission. Data collected by aDIS may be encrypted for additional security with a unique key held onlyby authorized parties.

In some embodiments of the DIS, sensors may be embedded to allow forlocalized information gathering, which can be used to trigger eventssuch as, but not limited to openings, closings, light detection, andhazard detection; status recording such as, but not limited totemperature, humidity, shock, and vibration; and other functions asrequested by the end user.

In some embodiments of the DIS, power recharging can be accomplishedthrough multiple sources and/or methods, such as, but not limited to theuse of solar, thermal, piezoelectric, magnetic, vibration, andradio-frequency. In some embodiments of the DIS, the units can bedeployable in items such as, but not limited to utility vehicles, smallparcel delivery vehicles, shipboard holds and shipboard areas, railcars,tractor trailers, and aircraft.

FIG. 1 is a schematic diagram that illustrates a DIS 140 that includesat least one body component (also referred to as an “assembly”) 100 andat least one wing component (also referred to as an “assembly”) 110,according to an embodiment. The body component 100 and the wingcomponent 110 can be operatively coupled by a connection component (orconnection element) 120. In some embodiments, body component 100 caninclude (not shown in FIG. 1) one or more of a primary power supply, anRFID interrogator, a processor such as a central processing unit (CPU)(e.g., a CPU with data storage capacity), a memory, a communicationmodem, a sensor (e.g., a door status sensor, an electromagneticradiation sensor, a vibration sensor, a temperature sensor, a pressuresensor, etc.), and/or an interconnection (e.g., a physicalinterconnection, a wireless interconnection) between one or more ofthese components.

In some embodiments, connection component 120 can include, for example,a hinge and/or a wire configured to communicate a signal. In someembodiments, connection component 120 can include a dual hinge that isconfigured to move about two axes. In some embodiments, body component100 and/or wing component 110 can include an attachment component ordevice (not shown) such as a strap, a latch, or other coupler configuredto secure wing component 110 to body component 100 such that movement ofswing component 110 relative to body component 100 is restricted orreduced.

In some embodiments, DIS 140 can have a software portion and/or ahardware portion configured to manage the components of DIS 140 (e.g.,monitor operations, control operations at a desirable level, controloperations within specified parameter values, maintain operations). Insome embodiments, the software and/or hardware of DIS 140 can haveembedded business logic. In some embodiments, wing component 110 caninclude one or more RFID interrogation antennas, a specialized radome tohouse the antenna, a set of magnets (e.g., series of magnets), and/or adetachment component (also can be referred to as detachment hardware orquick detachment hardware).

As shown in FIG. 1, DIS 140 is in an undeployed state with wingcomponent 110 being stowed near body component 100. In this embodiment,while DIS 140 is in the undeployed state, wing component 110 can bephysically attached to body component 100. Wing component 110 can bestowed using, for example, an attachment component or device (notshown), such as a strap, a magnet, a snap, a latch, a suction cup, ascrew, a portion of Velcro, double-sided tape, a press fit, a tensionfit, and so forth. The attachment component can be used to facilitateease of handling and installation. In some embodiments, wing component110 can at least partially be stowed within a housing (not shown)associated with body component 100, and vice versa.

In some embodiments, DIS 140 can include additional wing componentsand/or body components. For example, DIS 140 can include another wingcomponent similar to wing component 110 operatively coupled to bodycomponent 100. In some embodiments, additional wing components can becoupled to a body component with additional connection componentssimilar to connection components 120.

FIG. 2 is a schematic diagram that illustrates DIS 140 of FIG. 1 in adeployed state, according to an embodiment. As shown in FIG. 2, wingcomponent 110 has been rotated away from body component 100 byapproximately 90 degrees. In some embodiments, wing 110 can be rotatedand/or twisted away from the body component 100 at a variety of angles(e.g., obtuse angles, acute angles). In some embodiments, wing component110 rotates, twists, or moves about connection component 120. Forexample, connection component 120 can be a hinge configured to moveabout one or more axes. Wing component 120 can move about those axesduring movement (also referred to as conversion) from the undeployedstate to the deployed state, and during movement (also referred to asconversion) from the deployed state to the undeployed state. In someembodiments, connection component 120 is a cable or wire movable in manydirections or with many degrees of freedom, and wing component 110 canmove about connection component in any of those directions or withinthose degrees of freedom.

In some embodiments, a DIS can include two wing components eachoperatively coupled to a body component by a connection component. Thatis, such a DIS can include two wing components, two connectioncomponents, and the body component. The connection components, bodycomponent, and/or wing components can include a locking mechanismconfigure to lock or fix each wing component in a deployed state. Insome embodiments, the DIS can be free-standing in the deployed state. Inother words, the wing components can function as legs or supports forthe DIS in the deployed state, and the DIS can stand on the wingcomponents. In some embodiments, the locking mechanism can be configuredto be disengaged such that the DIS can be returned to the undeployedstate, for example, for storage.

FIG. 3 is a schematic diagram illustrating components of an embodimentof DIS 300, according to an embodiment. The DIS 300 can be configuredwith components that enable the DIS 300 to install a functionalinterrogation zone without requiring tools, or specialized RFID skill orknowledge. An interrogation zone is an area in which RF tagged items canbe placed to be within the effective coverage of the DIS. In otherwords, DIS 300 can be configured to be deployed, powered on, andfunction without additional configuration input from an end user.

DIS 300 includes a body 315, one or more wing assemblies (or wings) 303,an external multi-frequency communications antenna system 304, and asystem trigger 305. Additionally, body 315 and wing assemblies 303 eachincludes one or more attachment devices or elements 316 configured toattach DIS 300 to inside surfaces of an enclosure such as, for example,a container, a utility vehicle, a small parcel delivery vehicle, ashipboard hold or shipboard area, a railcar, a tractor trailer, or anaircraft. In some embodiments, body 315 can be referred to as a controlassembly. In some embodiments, a wing can be a fabric antenna includinga radiator. System trigger 305 can be used, for example, to activateand/or deactivate DIS 300. For example, system trigger 305 can be aswitch operatively coupled to an opening such as a door of a shippingcontainer or other enclosure in which DIS 300 is deployed. DIS 300 canbe activated by system trigger 305 when the door is closed anddeactivated when the door is open. In other embodiments, DIS 300 can beactivated once when the door closes and once again when the door isopened. Each wing 303 can contain a radiator/receptor 301 and atransmission line 302. Once transmission line 302 is disposed outside ofthe wing 303, transmission line 302 can be protected as part of theruggedized transmission line 307. Transmission line 307 can beruggedized, for example, by enclosing transmission line 302 in aprotective housing such as a rubber, plastic, or metal housing. In someembodiments, transmission line 307 can be flexible or semi-flexible suchthat wings 303 are movable with respect to body 315.

External multi-frequency communications antenna system 304 can be placedoutside the enclosure and connected to body 315 via a ruggedized coaxialribbon cable 306. A satellite modem 308 (labeled as “Comm”), bodyradiator/receptor 309 (labeled as “Radiator”), optional sensors (i.e.light, shock, vibration, temperature) 310 (labeled as “sensor”), centralprocessing unit (also referred to as “CPU” or “processor”) 311, reader(or “interrogator”) 312, communications modems (e.g., Wi-Fi™, GSM, GPRS,ZigBee™, Bluetooth™, mesh) 314 (labeled as “Comm”), and/or a powersupply 313 (labeled as “Power”) can be included, coupled to, or disposedwithin body 315. Some system components (e.g., body 315, wings 303,system trigger 305, and/or external multi-frequency communicationsantenna system 304) can be coupled to the enclosure surfaces withquick-mounting hardware including but not limited to: magnets, snaps,latch system, screw, Velcro, double-sided tape, etc.

In some embodiments, a memory (not shown) and/or a data interface (notshown) can also be included with, disposed with or operatively coupledto body 315. A memory can be, for example, magnetic storage media suchas hard disks, floppy disks, and magnetic tape; optical storage mediasuch as Compact Disc/Digital Video Discs (“CD/DVDs”), Compact Disc-ReadOnly Memories (“CD-ROMs”), and holographic devices; magneto-opticalstorage media such as optical disks; random access memories (“RAMs”);solid-state memory such as FLASH memory; and/or other types or classesof memory. In some embodiments, a memory can be an array of memorydevices. For example, a memory can include a redundant array ofindependent/inexpensive disks (“RAID”) that provides improved memoryperformance and/or redundancy. In some embodiments, DIS 300 includes aprimary memory and a backup memory. For example, DIS 300 can include amemory for primary storage of data and a RAID memory providing redundantbackup of data. In some embodiments, a memory can be modular, orremovable as a unit. For example, the backup RAID memory can be removedand replace with another backup memory. In other embodiments, a modularor removable memory can be a memory card such as a compact FLASH (“CF”)card, a secure digital (“SD”) card, or some other memory card, or someother removable memory device such as a Universal Serial Bus (“USB”)external hard drive, a USB FLASH drive or stick.

A data interface can be, for example, an interface to a memory such as aFLASH memory or a hard disk such as a mechanical hard disk or asolid-state disk (“SSD”). For example, a data interface can be aUniversal Serial Bus (“USB”) controller and port, an Ethernet controllerand port, an External Serial AT Attachment (“eSATA”) controller andport, and/or other interface. Data stored at the memory (not shown) canbe accessed (e.g., copied or downloaded) to an external device via thedata interface. In some embodiments, processor 311 can be operativelycoupled to the data interface and can detect when a device isoperatively coupled to the data interface. For example, the datainterface can be a USB interface, and processor 311 can detect when adata storage device is operatively coupled to the USB interface. In someembodiments, processor 311 can automatically upload data to a datastorage device operatively coupled to the USB interface. For example,processor 311 can store data acquired during interrogation of RF tags ata memory (not shown). When processor 311 detects that a data storagedevice is operatively coupled to a data interface (not shown), processor311 can upload the data from the memory to the data storage device. Insome embodiments, processor 311 is configured to upload a portion of thedata stored at the memory to the data storage device via the datainterface. For example, processor 311 can upload changes to the datastored at the memory since a previous upload of the data stored at thememory via the data interface.

In some embodiments, DIS 300 can include an authentication orauthorization module (not shown) such as, for example, a keypad (such asa physical keypad or a virtual keypad displayed on a touch-sensitivedisplay) or a biometric security module (such as a fingerprint reader, avoice identification module, or an eye scanner). DIS 300 canauthenticate a user based on a credential (or some other authenticationor authorization information) such as a pass code or encryption keyinput via the keypad, or based on one or more biometric parametersdetermined by the biometric security module before providing access todata stored at DIS 300. For example, a user can authenticate with DIS300 before downloading data via a data interface (not shown). In someembodiments, DIS 300 can destroy or delete data stored at DIS 300 if auser fails to authenticate after a predetermined number of attempts. Forexample, if a user fails to enter a correct pass code via a keypad (notshown) three times, DIS 300 can delete all data stored at a memory (notshown) of DIS 300. In some embodiments, DIS 300 can upload the data to asecure storage repository via satellite modem 308 and/or communicationsmodems 314 before deleting the data stored at the memory. In someembodiments, DIS 300 can be configured to self-destruct (e.g., shortcircuit or over-power electrical components) if a user fails toauthenticate. In some embodiments, a credential can be a digitalcertificate or encryption key input via a communication modem or datainterface (e.g., for a remote operator). In some embodiments, acredential can be a pass code generated by a hardware token and input tothe DIS, for example, via a data interface or keypad. In someembodiments, a credential is generated or defined using, for example,encryption or a hash based on a pass code, a biometric parameter, adigital certificate, or an encryption key.

In some embodiments, the components included within and/or operativelycoupled to body 315 can be operatively coupled one to another viainterconnects and/or communications busses (e.g., RS485 busses). Suchinterconnects and/or communications busses can be electricalconnections, optical connections, acoustic connections, RF connections,and/or other connections. For example, processor 311 can be operativelycoupled to a memory (not shown), satellite modem 308, system trigger305, body radiator/receptor 309, optional sensors 310, interrogator 312,communications modems 314, power supply 315, and/or other components. Insome embodiments, the components within and/or operatively coupled tobody 315 can be operatively coupled one to another heterogeneously viadifferent types of classes interconnects. For example, processor 311 canbe operatively coupled to a memory (not shown), body radiator/receptor309, optional sensors 310, and interrogator 312 via an RS485 connection,and to satellite modem 308 and communications modems 314 via a networkconnection such as an Ethernet connection.

Some components of DIS 300 can be automatically detected, and othercomponents can be configured manually. For example, processor 311 can beconfigured to execute system software such as an operating system (“OS”)(e.g., an embedded operating system or a real-time operating system).The system software can automatically detect and configure some systemcomponents (e.g., a memory (not shown), satellite modem 308, andcommunications modems 314) such that those components can be used by theDIS without further configuration. The system software can use operatorinput, configuration files, and/or other information separate from thesystem software to detect and/or configure other components (e.g.,system trigger 305, body radiator/receptor 309, optional sensors 310,and interrogator 312). In other words, DIS 300 can be configured to meetend user needs and requirements.

In some embodiments, the DIS 300 can be self-sufficient in that it doesnot require (or substantially does not require) an external power source(e.g., connection to a wall outlet) or a physical line connection tointerface with other systems. For example, power supply 313 can be abattery that provides operational power to the components of DIS 300.

Satellite modem 308 and/or communications modems 314 can provide remoteaccess to DIS 300. For example, DIS 300 can be installed within ashipping container, external multi-frequency communications antennasystem 304 can be operatively coupled to satellite module 308 andcommunications modems 314, and external multi-frequency communicationsantenna system 304 can be installed outside the shipping container. Anoperator can send operations commands to and/or access data stored atDIS 300 using a computing device such as a computer terminal, personaldigital assistant (“PDA”), smart phone, or other computing device thatis operatively coupled to satellite modem 308 and/or communicationsmodems 314 via a network. For example, satellite modem 308 and/orcommunications modems 314 can be operatively coupled to the Internet,and DIS 300 can be accessible via the Internet. Thus, DIS 300 can bedeployed and powered on (or activated), and a remote operator cancontrol DIS 300.

Operations commands can include various control and/or configurationcommands or signals. In some embodiments, a command can be a signal thatincludes a particular type of class of information. In some embodiments,a command can be a signal that includes multiple instructions. In someembodiments, a command can be a signal, and a DIS can execute or performsome action in response to the signal. For example, operations commandsor signals can include commands related to interrogating RF tags such asan interrogation command or signal configured to cause DIS 300 tointerrogate RF tags within an interrogation zone (e.g., within ashipping container) and to send an interrogation response result orsignal (e.g., data related to RF tags within the interrogation zone) viathe satellite modem 308 and/or communications modems 314. An operationscommand or signal can also be a disable command or signal configured tocause DIS 300 to issue a disable or kill command or signal to RF tagswithin an interrogation zone. An operations command or signal can be adata access command or signal. For example, DIS 300 can periodicallyinterrogate RF tags within an interrogation zone and can record at amemory (not shown) interrogation responses from the RF tags in theinterrogation zone. A remote operator can send a data access command toDIS 300 to access or retrieve the interrogation responses stored at thememory. For example, DIS 300 can send an inventory (e.g., identifiersand/or quantities) of RF tags (or objects to which the RF tags arecoupled) to a remote operator via satellite modem 308 and/orcommunications modems 314 in response to a data access command.

In some embodiments, communications between a remote operator and DIS300 can be encrypted, for example, to prevent unauthorized access to thedata included in the communications. In some embodiments, the remoteoperator authenticates with DIS 300 or DIS 300 will not respond to orrefuse to execute operations commands sent to DIS 300. For example, theremote operator can authenticate with DIS 300 using a credential such asa pass code, digital certificate, encryption key and/or otherauthentication methods. For example, a remote operator can send acredential to DIS 300 via satellite modem 308 and/or communicationsmodems 314. The remote user can be authenticated with DIS 300 if thecredential is authorized to access DIS 300 and/or provide operationscommands or signals to DIS 300.

In some embodiments, a remote user can send configuration commands toDIS 300 via satellite modem 308 and/or communications modems 314. Forexample, interrogator 312 and radiator 309 can be configured manuallyrather than automatically by system software executing at processor 311.The remote operator can send configuration commands or signals to DIS300 via satellite modem 308 and/or communications modems 314 toconfigure interrogator 312 and radiator 309. For example, the remoteoperator can send a configuration file and/or modify parameters of thesystem software to configure interrogator 312 and radiator 309.

In some embodiments, DIS 300 can include an image and/or video capturedevice (not shown) such as a camera. The image and/or video capturedevice can be operatively coupled to processor 311 and can be used, forexample, to record access to an enclosure in which DIS 300 is deployedor installed. For example, processor 311 can detect via system trigger305 when a door of an enclosure is opened, and can record one or moreimages or videos when the door is opened. In some embodiments, othersensors can be used to trigger image and/or video capture. For example,sensors 310 can include light, temperature, and/or oxygen sensors thatcan trigger image and/or video capture within an enclosure when a changein oxygen, temperature, and/or light is detected. In some embodiments,images and/or video can be stored at a memory (not shown) of DIS 300 andaccessed at a later time via a data interface (not shown) of DIS 300. Insome embodiments, images and/or video can be sent to a remote computingdevice and/or data storage repository via satellite modem 308 and/orcommunications modems 314. In some embodiments, images and/or video canbe date and/or time stamped. In some embodiments, an image and/or videocapture device can include illumination elements such as lights orinfrared light emitting diodes (“LEDs”) to enable image and videocapture in low-light conditions. In some embodiments, an image and/orvideo capture device can include a night vision module to enable imageand video capture in low-light conditions.

FIG. 4 illustrates one embodiment of a wing assembly configuration,according to an embodiment. Wing assembly 400 includes reader (orinterrogation) module 420, radiators 410 and 430, sensor 440, powermodule 450, power lines P4 and P5, and coupling devices F1, F2, F3, F4,F5 and F6. As illustrated in FIG. 4, reader module 420 is located atwing assembly 400 rather than at a main body assembly (also referred toas a “control assembly”) as illustrated in FIG. 3. Thus, some componentsof a DIS can be moved from a control assembly to one or more wingassemblies (or disposed at one or more wing assemblies rather than atthe control assembly). Reader module 420 is operatively coupled toradiators 410 and 430 via transmission lines T1 and T2, respectively.Reader module 420 is configured to be operatively coupled to a controlassembly (e.g., via a wireless communication link or connection, a wiredcommunication such as ruggedized transmission line 307 illustrated inFIG. 3, or some other wired or cabled method including a network cablesuch as a CAT-5, CAT-5e, CAT-6, or fiber optic cable), receive aninterrogation signal from the control assembly, and interrogate one ormore RF tags via radiators 410 and 430 in response to the interrogationsignal. In some embodiments, a wing assembly includes a single radiator.In other embodiments, a wing assembly can include more than tworadiators.

Wing assembly 400 includes power module 450 operatively coupled to powerlines P3 and P4. Power module 450 can be, for example, one or morebatteries and a power, voltage and/or current regulation circuit(s). Insome embodiments, power module 450 includes battery charging circuitry.In some embodiments, power module 450 is operatively coupled to acontrol assembly and includes voltage or current regulation circuitryconfigured to provide an appropriate voltage, current and/or powersignal to reader module 420 via power lines P3 and/or P4.

As illustrated in FIG. 4, wing assembly 400 includes coupling devices(or elements) F1, F2, F3, F4, F5 and F6. Coupling devices F1, F2, F3,F4, F5 and F6 can be magnets, latches, adhesives, rivets, and/or othercoupling devices configured to couple wing assembly 400 to a surface ofan enclosure. Coupling devices can also be referred to as attachmentdevices. For example, coupling devices F1, F2, F3, F4, F5 and F6 can bemagnets configured to removably couple wing assembly 400 to an insidesurface of a shipping container. The magnets can be sufficiently strongto secure wing assembly 400 to the inside surface of the shippingcontainer, but can be separated from the surface of the shippingcontainer by a user. In some embodiments, wing assembly 400 can bepermanently coupled to an enclosure via coupling devices F 1, F2, F3,F4, F5 and F6. The number of coupling device can be more or less thanshown based on end product needs such as, for example, product weight,shipping conditions, and/or environmental conditions, andcharacteristics of the coupling device (e.g., strength of an adhesive ormagnetic field generated at a magnet).

Additionally, wing assembly 400 can include sensor 440. Sensor 440 canbe operatively coupled to a control assembly (e.g., directly or viareader module 420). Sensor 440 can be, for example, a door statussensor, an electromagnetic radiation sensor, a vibration sensor, atemperature sensor, a pressure sensor, and/or other sensors. In someembodiments, more than one sensor can be implemented simultaneously.

FIG. 5 is a top-down transparent view of an attach/release wingconnection, according to an embodiment. As shown in FIG. 5, theattach/release wing connection includes a ruggedized transmission line504, which terminates behind a wing substrate 501, with an RF connector503, that can be quickly disconnected using the fasteners 506. Releasingthe flange 505 exposes RF connector 503 at the end of the ruggedizedtransmission line 504, which can be removed without the use of any toolsor specialized skill. As shown in FIG. 5, the wing includes transmissionline 504 with RF connector 503 and mounting flange 505.

The DIS can be configured to facilitate cost effective disposability ofthe wing assembly by reducing the costs of the materials of the finishedproduct to the point that it is more efficient to exchange units than toattempt repairs. In some embodiments, the unit can be designed for rapidreplacement by removing a securing mechanism (e.g., a couplingmechanism) and removing the connecting coaxial cable connector from themated mounted wing coaxial connector, then attaching the coaxial cableconnector to the replacement wing and then attaching the securingmechanism, which protects the cable and provides additional support tothe wing. The enclosed antenna can be configured to substantially reducemanufacturing costs while maintaining desired electricalcharacteristics. In some embodiments, the wing housing is manufacturedfrom materials such as Acrylonitrile Butadiene Styrene (ABS) plasticcommonly found in multiple industries. A slave wing can comprise one ormore antennas, transmission line, RF connector, housing, and/or securingmechanisms allowing for low manufacturing costs, allowing fordisposability or recycling of this assembly.

In some embodiments, the DIS can be configured with a low profile tosubstantially reduce the impact of the DIS on the amount of space neededwithin the enclosure. In other words, DIS can be designed with a lowprofile so that the DIS may not be an obstruction within an enclosureand reduce the space within the original enclosure prior to thedeployment (e.g., installation) of the DIS.

FIG. 6A illustrates an upper portion of a low-profile wing assembly, and6B illustrates portions of the low-profile wing assembly, according toan embodiment. FIGS. 6A and 6B illustrate how wing assembly constructionis designed to minimize overall thickness, while maintaining electricalcharacteristics desirable to ensure proper system performance in thedesignated operating frequency range. This minimized thickness ismaintained throughout the unit because of an electrical connectionlaunched from the side of the radiator/receptor (or antenna) 605 andattached to a specialized RF coaxial connector 602 secured to thesubstrate material via transmission line 601. These components areenclosed (or substantially enclosed) between backplane molding 603 andface substrate 604. Backplane molding 603 is configured to be adjacentto a surface of an enclosure to which the wing assembly illustrated inFIGS. 6A and 6B is coupled. For example, backplane molding 603 caninclude coupling devices or elements configured to couple the wingassembly to the surface of the enclosure. Face substrate 604 isconfigured to allow RF interrogation signals from antenna 605 topropagate through face substrate 604 to RF tags, and RF interrogationresponses from RF tags to propagate through face substrate 604 toantenna 605.

In some embodiments, a variety of attachment devices may be coupled tothe interior surface of the enclosure within which an RFID portal system(such as a DIS with the low-profile wing illustrated in FIGS. 6A and 6B)can function. This coupling method can be accomplished through the useof low-profile neodymium-iron-boron rare earth magnets attached to thewing substrate using rivets attached with a specialized rivet presswhere the enclosure is constructed of a magnetic material. Magneticfasteners also can be used to attach a main body of the RFID portalsystem to the surface of the enclosure. The use of a rivet press andspecially modified rivet-clincher with precise control over rivetcompression can be advantageous due to the brittle nature of theneodymium-iron-boron rare earth magnets. The clincher can be modifiedfrom its standard shape by removal of outer lip on the tip of the tool.The lip can be removed to cause the resulting shape of the rivetcompressed by the modified clincher, to be flatter than a rivetcompressed by a standard clincher, thereby allowing it to fit within acountersunk hole in the magnet.

In some embodiments, the method of attachment is as follows: a hole withthe same size diameter as the rivet can be drilled through the wingsubstrate. A rivet can then be placed through the hole with the head onthe opposite side of the substrate from the side which will be coupledto the enclosure surface. A neodymium-iron-boron rare earth magnet withcountersunk hole can be placed over the shaft of the rivet on the sideof the substrate which can be coupled to the enclosure surface with thecountersunk hole facing opposite the direction of the rivet head. Therivet can be compressed using a modified rivet clincher in a press. Therivet can be compressed to a precise length determined by the size ofthe magnet.

FIG. 7 illustrates a cross sectional view of an attachment device,according to an embodiment. FIG. 7 illustrates a wing substrate 701(such as backplane molding 603 illustrated in FIGS. 6A and 6B), a magnet702, a countersunk hole 703, and a rivet 704. In some embodiments, theattachment assembly shown in FIG. 7 can be used to attach one or moreneodymium-iron-boron rare earth magnet(s) to wing assemblies. One typeof magnet that works effectively has a countersunk hole to facilitateflat attachment to the enclosure wall.

FIG. 8 is a schematic diagram that illustrates a cross-sectional view ofa modification to a rivet clincher, according to an embodiment. Themodification to rivet clincher 801 can better fastenneodymium-iron-boron rare earth magnets (e.g., magnet 702 illustrated inFIG. 7) to wing assemblies. The diagram depicts a cross-sectional viewof a modification to the tip of a standard rivet clincher 801. Thedotted line 802 within the shape represents the outer edge of thematerial after the lip of the clincher tip 803 has been removed tomodify the standard rivet clincher 801. While a standard clinchercompresses the end of the rivet all the way back in the direction of thehead of the rivet but cracks the magnet in the process, the modifiedclincher doesn't bend the rivet as far, allowing a snug fit withoutcracking a magnet (e.g., magnet 702 illustrated in FIG. 7). The rivet isalso compressed into the countersunk hole in the magnet so as not tointerfere with attaching the final assembly to a flat surface.

FIG. 9 is a flowchart that illustrates a method for installing a DIS inat least a portion of an enclosure, according to an embodiment. As shownin FIG. 9, at least a portion of the DIS is attached to a portion of anenclosure at 900. In some embodiments, a portion of the DIS (e.g., wing,body) can be attached to an interior portion of an enclosure (e.g., ashipping container, a box, vending machine, server rack, etc.). In someembodiments, the body or a portion of a component attached to the bodycan be placed in contact with the inside roof of the enclosure whenbeing attached.

In some embodiments, the body can be attached by magnetic coupling orother attachment device (e.g., a screw, a rivet, latch, Velcro, etc.)depending on the material composition of the enclosure. For example, toretrofit a plywood lined semi-trailer, screws could be used to mount thebody to the interior of the trailer. For attaching the body tonon-magnetic enclosures, such as aluminum, common fasteners includingbut not limited to screws, double sided tape, or industrial strengthsuction cups can be used to affix the body to the interior of theenclosure.

At least a portion of the DIS is deployed at 910. In some embodiments,elastic straps used to stow one or more wings are detached one at a time(or at the same time). After one wing is detached, the wing can beplaced on, for example, a wall (e.g., vertical wall) near the side ofthe body to which the wing is attached. In some embodiments, the wingcan be automatically attached to the wall through magnetic couplingand/or other attachment component (also can be referred to as a couplingcomponent), for example, depending on the material composition of theenclosure. The wing can be attached using components and/or methodssimilar or different than those used to attach the body to theenclosure.

In some embodiments, if a wing of a DIS is attached to a portion of anenclosure before another portion of the DIS is attached to a portion ofthe enclosure, the body can be deployed. In other words, the body can bedeployed from the wing of the DIS. When one or more wings are deployedfrom the body, the DIS can be in a deployed state.

In some embodiments, if the DIS includes two wings, multiple attachmentcomponents can be used to stow each of the two wings when the DIS is inan undeployed state. For example, a first strap (or second set ofstraps) can be detached to deploy the first wing, and a second strap (orsecond set of straps) can be detached to deploy the second wing. In someembodiments, the straps can be elastic straps. In some embodiments, thesecond wing can be placed on a wall opposite the wall that the firstwing is attached. The first wing and/or second wing can be configured toattach to the wall through magnetic coupling and/or different attachmentcomponent, for example, depending on the material composition of theenclosure. In some embodiments, the first wing and the second wing canbe placed on the same wall. In some embodiments, the first wing, thesecond wing, and/or the body can be placed on different portions of theenclosure (e.g., floor, ceiling, walls, support beam, door, etc.)

An external communication antenna is placed on an outside portion of theenclosure at 920. The outside portion can be, for example, an outsideportion or surface of a door, a top, side, and/or bottom portion of theenclosure. In some embodiments, the external communication antenna canbe associated with a bundle of external communications antennas. In someembodiments, the external communication antenna can be placed on theoutside portion of the enclosure through magnetic coupling and/or adifferent attachment component, for example, depending on the materialcomposition of the enclosure. In other words, the communication antennacan be attached to the enclosure using components and/or methods similarto those described in connection with the body and/or wing. In someembodiments, the external communication antenna can be disposed suchthat the external communication antenna is partially within an enclosureand partially without the enclosure. That is, the external communicationantenna can be neither entirely within or entirely without theenclosure. In some embodiments, where the enclosure allows the passageof electromagnetic radiation (e.g., RF energy or waves) through materialor materials comprising the sides of the enclosure, the externalcommunication antenna or system can reside completely within theenclosure.

In some embodiments, the external communication antenna can be connectedto the body through a coaxial cabling system (e.g., a low profilecoaxial cabling system and/or a ruggedized coaxial cabling system) via,for example, a door seal. The coaxial cabling system can be a ribboncable having a disconnect terminator on one end that attaches to thebody and having RF connectors on another end that to attaches to theexternal communication antenna(s). To a desirable extent, antennas canbe used to interface with more than one communication modems to reducethe number of antennas on the outside of the enclosure.

Operation of the DIS can be triggered at 930. In some embodiments, onceone or more portions of the DIS are physically installed (e.g., bodyattached, wing attached), the DIS can be brought online (e.g.,powered-up) through one of a variety of wireless communications systemsincluding satellite, cellular, Wi-Fi and mesh networking technology. Insome embodiments, the DIS can be automatically triggered to operate inresponse to being attached to an enclosure. In some embodiments, the DISsystem can be configured to automatically sense the status of the door.In some embodiments, the DIS system can be configured to automaticallyinventory in response to the door being closed. For example, when thedoor is closed, the system automatically launches an interrogation cycleusing one or more interrogation radiators/receptors (or antennas), thenumber of which depends on the dimensions of the enclosure and theexpected difficulty associated with reading the tags. More detailsregarding triggering of interrogation are set forth in the commonlyowned U.S. Pat. No. 7,256,682, “Remote Identification of ContainerContents by Means of Multiple Radio-frequency Identification Systems,”the disclosure of which is incorporated herein by reference in itsentirety. In some embodiments, a DIS can be configured to automaticallydetect changes on the inside of the enclosure (e.g., light levels, airpressure, movement, etc.) and trigger an appropriate (e.g., programmedor based on a particular change or combination of changes) action suchas, for example, start an inventory or interrogation process or cycle,notify outside or remote personnel (e.g., a remote operator) or systems,activate recording devices (e.g., image and/or audio capture devices),and/or trigger a visual or audible alarm.

A DIS can interrogate RFID modules by receiving a trigger orinterrogation command or signal at a processor or processor module. Theprocessor can receive the interrogation command and send an interrogatecommand to an RFID reader or interrogator. The RFID reader can thengenerate an RF signal that is transmitted (e.g., via a transmissionline) to a radiator or antenna. The RF signal is configured to radiateRFID modules such that the RFID modules respond (e.g., transmit aninterrogation response) to the RF signal. The RFID reader can receivethe interrogation response via the antenna, and send that interrogationresponse (or data related to that interrogation response) to theprocessor module. In some embodiments, the interrogation response caninclude data related to an object to which the RFID module is attached.In some embodiments, the interrogation response can include data relatedto an RFID module identifier such as a unique identifier of an RFIDmodule or a class of RFID modules.

Once the data (e.g., inventory related information) is received (e.g.,captured) by the DIS, the data can either be forwarded (e.g., forwardedimmediately) to a centralized storage repository, or stored on-board theenclosure to be forwarded at a later time in batch. The data can beaccessed either directly on the physical system described above or in acentralized repository or both. In some embodiments, the DIS can beconfigured to only forward information (and/or permit interrogation)when the DIS is in an undeployed state. In some embodiments, the DIS canbe configured to only forward information (and/or permit interrogation)when the DIS is in a deployed state. In some embodiments, the DIS can beconfigured to forward information (and/or permit interrogation) and/orchange to a forwarding state when the DIS changes from a deployed stateto an undeployed state, and vice versa. In some embodiments, theportions of the flowchart can be performed in a different order and/orinclude more or fewer steps than illustrated in FIG. 9. For example,data may be captured before the DIS is fully deployed within anenclosure.

In some embodiments, all or substantially all required hardware for anRFID system (or portal) can be fully encased in a single DIS unitincluding the RFID interrogator, central processing unit, power supply,external communications capabilities and more making the installationand removal process easier to handle or simpler. In some embodiments,the DIS can be installed in a matter of minutes. In some embodiments,the DIS can provide total asset visibility down to the unit level andautomatically update inventory level(s) when tagged assets are placed inor removed from the enclosure. In some embodiments, the attachmentcomponents (e.g., magnetic system) require in the enclosure no holes formounting purposes, which maintains the environmental and mechanicalintegrity of the enclosure. In some embodiments, the enclosureopening/closing sensor (e.g., switch) and external communicationsantennas can be installed in a single step. In some embodiments, thewing and body hardware can be low profile (e.g., fractions of an inch),thereby minimizing the risk of direct impact and the amount of cubicspace consumed by the DIS. In some embodiments, the wing infrastructurecan be designed to be disposable thereby minimizing maintenance expense.

In some embodiments, the interrogation zones are defined by theplacement of a DIS body that contains an interrogator and antennas, inaddition to the placement of master and/or slave wings (e.g., mounted onceiling, walls, and/or door). These zones may be further defined throughembedded software and/or hardware to provide multiple zones within theoverall coverage area.

FIG. 10 is a schematic diagram of at least some electrical connectionswithin a DIS, according to an embodiment. In some embodiments of theDIS, the body contains an interrogator (or RFID reader) capable ofexchanging RF energy with wing assemblies through a radio-frequencyswitch (or RF switch). The wing assemblies have one or more radiatorsand may not include any interrogators installed or disposed within. TheRF switch can contain one or more inputs and one or more outputs toroute RF energy from the interrogator through to each of the installedslave wing assemblies in a prescribed order as dictated by the needs andrequests of the end user, thus providing efficient use of a singleinterrogator with multiple antennas. Multiple antennas can provideimproved performance across larger areas, increasing the ability tointerrogate RF tags in range.

In some embodiments, DIS 1000 includes power components, a processor,sensor modules, a RFID interrogator and antennas, an active RFID module,communications modules, and a GPS module. The power components of DIS1000 include power source 1011, power source 1013, a charging module1015, power pack 1017, and power regulator 1019. Power sources 1011 and1013 can be separate and/or independent power sources, and can alsoprovide power directly to power regulator 1019. Power sources 1011and/or 1013 can be, for example, a solar panel, an connection to anelectric grid, a power-over-Ethernet (or “PoE”) module, and or someother power source or power harvesting device, component, or system.Charging module 1015 can be mechanical and/or electrical elementsconfigured to charge power pack 1017 by using power or energy suppliedby power source 1011 and/or power source 1013. Power pack 1017 caninclude batteries, capacitors, and/or other electrical energy storagecomponents. For example, power pack 1017 can include lithium polymer,lithium ion, nickel metal hydride (or “NiMH”), nickel cadmium (or“NiCd”), and/or other battery cells. Power regulator 1019 can provideone or more power lines to provide electrical power to variouscomponents of DIS 1000. For example, power regulator 1019 can receiveone input voltage level from power pack 1017, and can provide multiplevoltage levels to various components of DIS 1000.

As illustrated in FIG. 10, power line P 1 is provided from powerregulator 1019 to processor 1031. Although not illustrated in FIG. 10,additional power lines (with various voltage levels) can be provided bypower regulator 1019 to processor 1031 and/or other components of DIS1000. Additionally, power regulator 1019 can receive control signals orcommands from processor 1031 via control line C1. Power regulator 1031can, for example, disable a power line or change a voltage level inresponse to a signal or command from processor 1031. For example,processor 1031 can disable one or more of sensor modules 1091, 1093,1095, and/or additional sensors not shown in FIG. 10 by sending acontrol signal or command to power regulator 1019 to disable power tothat sensor module(s).

In some embodiments, processor 1031 is operatively coupled to sensormodules 1091, 1093, and 1095, active RFID module 1081, wiredcommunications module 1041, wireless communications modules 1061, 1063and 1065, global positioning system (“GPS”) module 1071, andinterrogator 1021. Interrogator 1021 is operatively coupled to a numberof antennas via RF switch 1023. In some embodiments, processor 1031 isalso operatively coupled to RF switch 1023, for example, to switchbetween the various antennas operatively coupled to interrogator 1021via RF switch 1023.

In some embodiments, processor 1031 can interrogate RF tags (or RFIDmodules) within an interrogation zone such as a shipping container orother enclosure via interrogator 1021 and RF switch 1023. For example,processor 1031 can send an interrogation command (or signal) tointerrogator 1021, and interrogator 1021 can send one or moreinterrogation signals (or commands) through the antennas operativelycoupled to RF switch 1023 to interrogate RFID modules. In someembodiments, interrogator 1021 can configure RF switch 1023 to radiate afirst interrogation signal through a first subset of the antennas, and asecond interrogation signal through a second subset of antennas inresponse to an interrogation command from processor 1031. In someembodiments, the antennas are operatively coupled to a group of wingassemblies distributed throughout an enclosure. Interrogator 1021 canreceive interrogation responses from the RFID module via the antennas,and send the interrogation responses to processor 1031. Processor 1031can store the interrogation responses at a memory (not shown in FIG. 10)operatively coupled to processor 1031 and/or send an interrogationresult to a computing device or storage repository (not shown in FIG.10) via one or more of wireless communication modules 1061, 1063, and1065. An interrogation result can include, for example, a summary orinventory of RFID modules that responded to an interrogation signal(e.g., provided an interrogation response after receiving aninterrogation signal), data from one or more of sensor modules 1091,1093 and 1095, one or more geographic location coordinates, and/orinterrogation responses.

In some embodiments, processor 1031 can determine a position of an RFIDmodule within an enclosure based on interrogation responses. Forexample, the antennas operatively coupled to RF switch 1023 can beattached at positions within the enclosure that are provided toprocessor 1031. In other words, processor 1031 can be aware of therelative positions of the antennas within the enclosure. Processor 1031can send an interrogation command (or signal) to interrogator 1021, andinterrogator 1021 can provide a number of interrogation signals (orcommands) to the antennas via RF switch 1023. For example, interrogator1021 can select one antenna (or a subset of antennas) at RF switch 1023can provide an interrogation signal (or command) to that antenna. TheRFID modules within the enclosure can respond to the interrogationsignal (or command), and interrogator 1021 can provide variousparameters to processor 1031 related to the interrogation responses. Forexample, interrogator 1021 can provide an identifier of the antenna (orantennas) used to interrogate the RFID module, the time before theinterrogation response was received from each RFID module, and/or asignal strength of the interrogation response received from each RFIDmodule. This can be repeated for each antenna (or subset of antennas).After processor 1031 has received the parameters related to theinterrogation responses received at each antenna (or subset ofantennas), the processor can calculate or triangulate a position of oneor more RFID modules within the enclosure based on the position of eachantenna and the parameters received from interrogator 1021.

In some embodiments, interrogation responses can include an identifierof the RFID module sending the interrogation response, and thatidentifier can be associated with or related to a particular object. Forexample, an RFID module with a particular identifier can be attached toa container such as a box including books. Processor 1031 can access adatabase (such as a relational database) at a memory (not shown) or viaone or more of wireless communication modules 1061, 1063, and 1065 torelate the identifier to information about the contents of thecontainer. Thus, processor 1031 can determine whether a particulararticle, device, or object is located within an enclosure, and where inthe enclosure the article, device, or object is located.

As discussed above, processor 1031 can communicate with a remotecomputing device via one or more of wireless communication modules 1061,1063, and 1065. Processor 1031 can additionally receive data via sensormodule 1091, 1093, and/or 1095 and transmit the sensor data via one ormore of wireless communication modules 1061, 1063, and 1065. In someembodiments, DIS 1000 can be operatively coupled or in communicationwith one or more other DISs via one or more of wireless communicationmodules 1061, 1063, and 1065. Additionally, processor 1031 can be incommunication with computing devices and/or other DISs via wiredcommunications module 1041. For example, wired communication module 1041can be an Ethernet module (such as a network interface card or “NIC”)and DIS 1000 can communicate with other DISs or a computing device viathe Ethernet module. In some embodiments, power source 1011 or powersource 1013 can be a PoE module and can also be coupled to the Ethernetmodule and can receive power via an Ethernet cable.

In some embodiments, one or more of wireless communication modules 1061,1063, and 1065 can share an antenna with GPS module 1071. In otherembodiments, GPS module 1071 does not share an antenna. Processor 1031can communicate with GPS module 1071 to determine a geographic locationof DIS 1000. In some embodiments, processor 1031 can receive ageographic location via GPS module 1071 and determine whether DIS 1000is within a predefined geographic region. The predefined geographicregion can be referred to as a virtual yard, and processor 1031 can takevarious actions in response to the geographic location or position ofDIS 1000 relative to the virtual yard. For example, processor 1031 candetermine that DIS 1000 is within the virtual yard, and can interrogateRFID modules and store or send via one or more of wireless communicationmodules 1061, 1063, and 1065 an inventory of objects in a containerbased on the determination that DIS 1000 is within the virtual yard. Insome embodiments, processor 1031 can delete data stored at DIS 1000 ifprocessor 1031 determines that DIS 1000 is not within the virtual yard.In some embodiments, processor 1031 can destroy a portion of DIS 1000(e.g., delete data and apply a destructive voltage to electricalcomponents) if processor 1031 determines that DIS 1000 is not within thevirtual yard. In other words, processor 1031 can issue a destructcommand to a portion of DIS 1000. In some embodiments, processor 1031can issue a destruct command to a processor module including processor1031 such that processor 1031 self-destructs. In some embodiments, datacan be uploaded to a storage repository via one or more of wirelesscommunication modules 1061, 1063, and 1065 or wired communicationsmodule 1041 before DIS 1000 is destroyed.

For example, FIG. 16 is a flowchart of process 1600 for interrogating anRFID module with a DIS, according to an embodiment. An operationscommand or signal such as an interrogation command or signal can bereceived at a DIS, at 1610. An operations command or signal can also be,for example, a data access command or signal, or a configuration commandor signal. Before processing the operations command received at 1610, aDIS can calculate or determine a geographic location of the DIS, at1620. For example, a DIS can access a GPS module to determine ageographic location of the DIS. In some embodiments, a DIS can accessmultiple GPS modules and/or GPS correction modules (e.g., to improveprecision or accuracy of geographic location information received fromthe GPS module) to calculate a geographic location.

The DIS can then determine whether the geographic location is within apredefined geographic region, at 1630. In some embodiments, theoperations command or signal received at 1610 includes a definition ofthe predefined geographic region. In some embodiments, one or morepredefined geographic regions are stored at a memory of the DIS. In someembodiments, the DIS can select a predefined geographic region based ona type, class, or parameter of the operations command received at 1610.If the geographic location is not within the predefined geographicregion, a DIS implementing process 1600 can return to step 1610 toreceive other operations commands or signals. In other words, the DIScan determine that the operations command initially received at 1610should not be executed because the DIS is not within a predefinedgeographic region.

If the geographic location calculated at 1620 is within the predefinedgeographic region, a DIS implementing process 1600 can interrogate oneor more RFID modules, at 1640. Typically, interrogating RFID modulesincludes transmitting or radiating one or more interrogation signals (orcommands) at one or more antennas, and receiving interrogation responsesfrom the RFID modules via the one or more antennas. At 1650, theinterrogation responses can be used to determine an interrogationresponse result. For example, an interrogation response result (or“interrogation result”) can be determined by generating a summary at theDIS of the interrogation responses. For example, an interrogation resultcan include a number of RFID modules that responded to (e.g., send aninterrogation response that was received by the DIS) the interrogationsignals. In some embodiments, interrogation results can include otherinformation such as, for example, a categorized listing of RFID modules,a categorized listing of objects to which the RFID modules are attached,the number of a particular object to which RFID modules are attached,and/or other information about RFID modules and/or objects to which RFIDmodules are attached that were interrogated by the DIS.

The interrogation response result can be sent, at 1660. For example, theinterrogation response result can be sent via a satellite communicationslink, a wireless network communications link, a mesh networkcommunications link, and/or via some other communications link. In someembodiments, the interrogation response result can be sent to and storedat a storage repository. In some embodiments, the interrogation responseresult can be sent to a computing device from which the operationscommand or signal received at 1610 was received, or to some othercomputing device. Additionally, process 1600 can include more or fewersteps than those illustrated in FIG. 1600. For example, in someembodiments, the geographic location is not calculated, but is accessed,for example, at a memory of the DIS. In some embodiments, for example,authentication information is received and verified (or validated orprocessed) before RFID modules are interrogated and the interrogationresponse result is sent. If the authentication information cannot beverified (or validated or processed), process 1600 can return to 1610.

Referring now to FIG. 10, in some embodiments, DIS 1000 can receive anoperations command (or signal) via one or more of wireless communicationmodules 1061, 1063, and 1065 and can determine whether DIS 1000 iswithin a particular geographic region before executing or responding tothe operations command. For example, DIS can receive an interrogationcommand (or signal) via one or more of wireless communication modules1061, 1063, and 1065, and can acquire a geographic location from GPSmodule 1071 in response to the interrogation command (or signal). If thegeographic location is within a predefined geographic region, DIS 1000can interrogate RFID module within an interrogation zone and send aninterrogation result in response to the interrogation command (orsignal). If the geographic location is not within the predefinedgeographic region, DIS 1000 can ignore the interrogation command (orsignal). In other words, DIS 1000 cannot interrogate the RFID moduleswithin the interrogation zone because DIS 1000 is not within thepredefined geographic region.

In some embodiments, an operations command can include a definition of ageographic region as parameter and DIS 1000 can respond to theoperations command if DIS 1000 is within the geographic region. Forexample, DIS 1000 can receive an interrogation command with a geographiclocation and a radius. The geographic location and radius can define ageographic region of a circle with the radius centered at the geographiclocation. DIS 1000 can determine its geographic location, and canrespond (e.g., interrogate RFID module within an interrogation zone) ifits geographic location is within the radius from the geographiclocation included in the interrogation command. Such embodiments can beparticularly beneficial in applications in which an object is to belocated within a certain distance from a geographic location.

Active RFID module 1081 can transmit data or information about thecontents of an enclosure outside the enclosure. For example, active RFIDmodule 1081 can include a battery or other power element that providesactive RFID module 1081 with a communications range that is greater thanthe communications range of an RFID module (or passive RFID module)within the enclosure. In some embodiments, active RFID module 1081 canbe located outside the enclosure. Processor 1031 can interrogate theRFID modules within the enclosure via interrogator 1021, RF switch 1023and antennas, and can upload an interrogation result to a memory withinactive RFID module 1081. Active RFID module 1081 can then be read orinterrogated outside the enclosure.

FIG. 11 is a schematic diagram of at least some connections within aDIS, according to an embodiment. In some embodiments of the DIS, aninterrogator can be included or disposed into the wings assemblies of aDIS. These wings may receive power from the body via cabling, or mayreceive power from a self-contained power source built within the wingassembly. Wings with interrogators (also referred to as master wings)may be connected to and use wings without interrogators (also referredto as slave wings) to extend its coverage (e.g., an RF interrogationzone) and capabilities. An advantage of using this embodiment is thatthe lengths of coaxial cable is reduced, which also reduces theinsertion loss associated with the cables, which in turn effects thetransmitted signal level and the level of the received signal. Multipleantennas provide improved performance across larger areas increasing theability to interrogate RF tags in range.

DIS 1100 includes power components, a processor, sensor modules, RFIDradiator (or interrogator) modules, an active RFID module,communications modules, and a GPS module. DIS 1100 is similar to DIS1000 illustrated in FIG. 10 and discussed above. Rather than aninterrogator and RF switch coupled to multiple antennas as in DIS 1000,DIS 1100 uses radiator modules 1121, 1123 and 1125 to interrogate RFIDmodules. Radiator modules 1121, 1123 and 1125 can be, for example, awing assembly including an interrogator or a wing assembly including aninterrogator and a radiator. A radiator module can also be referred toas an interrogator module. Wing assembly 400 illustrated in FIG. 4 is anexample of a radiator module. Each radiator module 1121, 1123 and 1125can include an interrogator and one or more antennas, and can be mountedor attached to various surfaces within a container. In some embodiments,radiator modules can be used in combination with an interrogator and RFswitch operatively coupled to multiple antennas.

In some embodiments, a processor (or processor module), radiator moduleand/or interrogator (or interrogator module) can be adaptive. In otherwords, a processor module can store at a memory information related to anumber of repeated interrogation attempts and/or power levels ofinterrogation response and determine an appropriate power level for aninterrogation signal at a particular wing assembly or antenna. Forexample, if a radiator module requires multiple repeated interrogationattempts to receive an interrogation response from an RFID module or ifthe interrogation response is received at a low power level, thatradiator module can be obstructed from the RFID module or can experienceinterference. A processor module or interrogator module can increase thesignal strength of an interrogation signal sent to that radiator module(or radiator or antenna) to determine whether the increased signalstrength improves reception of interrogation responses. If the increasedsignal strength results in improved interrogation responses, theprocessor module or interrogator module can set the signal strength forthat radiator module. If the increased signal strength does not improveinterrogation responses, the processor can further increase the signalstrength and/or can inform a user (e.g., via a communications modem orlink) of an error. Additionally, a processor module and/or interrogatormodule can lower a signal strength for a radiator module (or radiator orantenna) to level that provides acceptable interrogation responses inorder to save or economize power consumption of the DIS.

FIGS. 12A, 12B and 12C illustrate the installation of one embodiment ofthe DIS. FIG. 12A depicts apparatus 1203 (e.g., a DIS) as it is coupledto the ceiling 1201 of an enclosure 1202. The apparatus 1203 (e.g., DIS)has its wings folded in and held in place by quick-release fasteners(e.g., attachment devices which are not shown). FIG. 12B illustrates thefirst of one or more wings 1205 having been released and coupled to theenclosure wall. FIG. 12C illustrates the second wing 1206 deployed, suchthat both wings (1205 and 1206) are coupled to the walls. FIG. 12C alsoshows a representation of an electromagnetic field within anewly-defined interrogation zone 1200. In some embodiments, DIS 1203 caninclude additional wings. For example, in some embodiments a wing can beattached to the floor (opposite ceiling 1201) of enclosure 1202.

In some embodiments, DIS 1203 can be active as objects with attachedRFID modules are loaded into enclosure 1202. DIS 1203 can interrogateeach RFID module to determine whether the object to which the RFIDmodule is attached should be in enclosure 1202. For example, each RFIDmodule can respond to an interrogation signal from DIS 1203 with aninterrogation response including an identifier of that RFID module. DIS1203 can access a database to determine whether than RFID module (or theobject to which that RFID module is attached) is authorized to be inenclosure 1202. If an RFID module (or the object to which that RFIDmodule is attached) is loaded into the enclosure 1202 and is notauthorized to be in enclosure 1202, DIS 1203 can provide an indicationor alarm. For example, a light can be illuminated or an audio alarm(such as a buzzer) sounded at DIS 1203. In some embodiments, DIS 1203can also provide an indication that an object or RFID module attached tothat object is authorized to be in enclosure 1202. For example, DIS 1203can illuminate a green light if an object is detected that is authorizedto be in enclosure 1202, and a red light if an object is detected thatis not authorized to be in enclosure 1202. Additionally, DIS 1203 canprovide an alarm if a user fails to authenticate with DIS 1203 at akeypad or biometric security module with some limit. In someembodiments, indications and/or alarms can be transmitted to a remotecomputing device or storage repository via one or more of wirelesscommunication modules 1061, 1063, and 1065, or wired communicationmodule 1041.

FIG. 13 illustrates an embodiment of a DIS. In some embodiments of theDIS, a body unit containing an interrogator and one or more antennas, inaddition to the other previously mentioned subsystems can be deployedfor where master or slave wings are not present, required or necessary.This situation can include, but is not limited to, a smaller confinedspace, an area which does not require more significant coverage, and/orwhere wing assemblies are not necessary to adequately define aninterrogation zone within an enclosure (e.g., where electromagneticradiation from the antennas included in the body unit of the DIS issufficient to define an adequate interrogation zone). In someembodiments, multiple DIS units can be configured to communicate withone another and synchronize inventory-related information.

As illustrated in FIG. 13, DIS 1313 and DIS 1323 are attached toenclosure 1302. An assembly of DIS 1313 is coupled or attached to asurface of an upper portion (or ceiling) 1301 of enclosure 1302. Wings1315 and 1316 of DIS 1313 are attached to surfaces of side portions (orwalls or sidewalls) 1304 and 1305, respectively, of enclosure 1302.Similarly, an assembly of DIS 1323 is coupled or attached to a surfaceof an upper portion (or ceiling) 1301 of enclosure 1302. Wings 1325 and1326 of DIS 1323 are attached to surfaces of side portions (or walls orsidewalls) 1304 and 1305, respectively, of enclosure 1302. In someembodiments, DIS 1313 can be operatively coupled to DIS 1323. Forexample, DIS 1313 and DIS 1323 can be operatively coupled via a cable orwireless communication link. DIS 1313 and DIS 1323 can communicate onewith another as part of an interrogation cycle to determine which RFtags have responded to an interrogation signal, and/or a position of theRF tags within container 1302. Such configurations can be useful, forexample, to define or establish one or more interrogation zonesthroughout an enclosure such as a shipping container or other enclosure.

FIG. 14 is schematic diagram that illustrates an array of wingsoperatively coupled to a body assembly (or control assembly) of a DIS,according to an embodiment. As shown in FIG. 14, an interrogator can beplaced into the wings. In some embodiments, the interrogator can beremoved from a body assembly and disposed within a wing assembly. Inother embodiments, a body assembly includes an interrogator, and a wingassembly includes an interrogator. These wings can receive power fromthe body via cabling, or might receive power from a self-contained powersource built within the wing assembly. Master wings (“masters”), whichhave interrogators, can be connected to and use wings withoutinterrogators (can be referred to as slaves wings or “slaves”) to extendthe coverage and capabilities of the master wings. In this embodiment, aprocessor module (or control assembly) is connected to at least onemaster wing using a wired and/or wireless communication link. In someembodiments, the link can be a wired connection such as apower-over-Ethernet (“PoE”) connection, a wireless connection such as aBluetooth™ connection, or some other wired or wireless connection.

DIS 1400 includes processor module 1410 operatively coupled viacommunication link C3 to radiator modules 1421 and 1441. Radiatormodules (or wing assemblies such as wing assembly 400 illustrated inFIGS. 4) 1421 and 1441 are masters and include interrogators 122 and142, respectively. Additionally, radiator modules 1421 and 1441 includeradiators R23 and R43, respectively. Radiator module 1421 is operativelycoupled to radiator modules 1424 and 1427, which are slaves. That is,radiator modules 1424 and 1427 do not include interrogators, but doinclude radiators R25 and R26, and R28 and R29, respectively.Interrogator 122 can interrogate RFID module via any or all of radiatorsR23, R25, R26, R28, and/or R29.

Radiator module 1421 is also operatively coupled to radiator module1431. Radiator modules 1421 and 1431 can be operatively coupled via awired or a wireless connection. Radiator module 1431 is operativelycoupled to radiator modules 1434 and 1437, which are slaves. That is,radiator modules 1434 and 1437 do not include interrogators, but doinclude radiators R35 and R36, and R38 and R39, respectively. Similarly,radiator module 1441 is operatively coupled to radiator modules 1444 and1447, which are slaves. That is, radiator modules 1444 and 1447 do notinclude interrogators, but do include radiators R45 and R46, and R48 andR49, respectively.

In some embodiments a master wing can have a power supply independentfrom a power supply of processor module 1410, and can provide power toslaves from the mater's power supply. For example, masters can beoperatively coupled to slaves via a wired connection to provideoperational power or energy to slaves. In some embodiments, slavesreceive power from a master in the form of an interrogation signal. Thatis, slaves can be passive radiator/receptors (e.g., antennas) thatradiate interrogation signals provided by masters. In some embodiments,one master can provide operational power to another master. For example,radiator module 1421 can provide operational power to radiator module1431 via a wired connection.

In some embodiments, processor module 1410 can detect radiator modules1421, 1431, and 1441 (masters) when they are activated (e.g., poweredon) or connected to processor module 1410. For example, radiator modulescan have unique identifiers that can be received by processor module1410 to determine that radiator modules are or can be operativelycoupled to processor module 1410. In some embodiments, a master radiatormodule can periodically announce itself including its identifier, andprocessor module 1410 can receive the identifier. In some embodiments, amaster radiator module can cease to announce itself after it has beenoperatively coupled to or associated with a processor module (such asprocessor module 1410). In some embodiments, processor module 1401 canpoll for or request identifiers from master radiator modules to discovermaster radiator modules that are available. The master radiator modulescan respond to the polling or requests with an identifier and/or otherinformation if available to be associated with processor module 1410.

Processor module 1410 can receive the identifiers (or other information)and can send an association request including the identifier to eachmaster radiator module. The master radiator modules can then associatewith processor module 1410 such that the master radiator modules respondto interrogation and other commands from processor module. In someembodiments, this process can occur without input from a user such thata processor module and radiator module can be physically installedwithin an enclosure, the processor module and radiator modulesphysically connected and/or activated, and the DIS can automaticallyconfigure itself. In some embodiments, more or fewer radiator modules(masters and slaves) can be included in DIS 1400 than are illustrated inFIG. 14.

In some embodiments, wing assemblies (or radiator modules) can bephysically or functionally expandable. For example, additional radiatorscan be coupled to a wing assembly to increase the size and/orsensitivity of the wing assembly. In some embodiments, a wing assemblycan include a folding portion including one or more radiators that canbe folded behind or in front of a main portion of the wing assembly. Thefolding portion can be unfolded to expose the additional one or moreradiators and increase the size and/or sensitivity of the wing assembly.For example, in some embodiments a wing assembly is a fabric wingassembly such as a flexible material including one or more conductiveportions configured to function or operate as radiators (or antennas).The fabric wing assembly can be folded onto itself for ease of storage,and unfolded and attached (e.g., using magnets or adhesives) whendeployed in an enclosure. In some embodiments, a wing assembly caninclude a sliding portion including one or more radiators that can beslid behind or in front of a main portion of the wing assembly. Thesliding portion can be slid from behind or in front of the main portionof the wing assembly to expose the additional one or more radiators andincrease the size and/or sensitivity of the wing assembly.

In some embodiments, the components of elements of a DIS can be networkdevices in communication one with another via a network. For example, aprocessor module, radiator modules (or wings), communications modules,and/or a GPS module can each include a network interface module and cancommunicate one with another via the network interface modules. Forexample, the components of the DIS can form a network such as anInternet Protocol (“IP”) network. In some embodiments, the network caninclude a network router, a network switch, a network hub, a networkgateway, and/or a network bridge. For example, a processor module caninclude a network switch to which each of the network interface modulesof the components of the DIS are operatively coupled. In someembodiments, the network can be automatically configured (e.g., DIScomponents can be discovered and assigned a network address oridentifier and/or attributes) using, for example, the dynamic hostconfiguration protocol (“DHCP”), a zero configuration network protocolsuch as the Internet Engineering Task Force (“IETF”) Zeroconf, and/orother protocols of methods.

FIG. 15 illustrates various communication paths for communicating datacaptured from a DIS deployed within enclosure 1500, according to anembodiment. In some embodiments, the data can be inventory-relatedinformation (e.g., data communicating the inventory (type, quantity)within the enclosure after being determined by a DIS). The systems showninclude a passive RFID antenna 1501, reader 1503, and RF tag 1502.Information gathered by this system is communicated through mechanismsincluding, for example, an active RFID system comprised of an active tag1504 and reader 1505. Data may also be ported to users through aflexible communications module 1508 to mesh networks 1510, cellularnetworks 1506, and/or a satellite communications network 1509. Theflexible communications module can also be configured to interface witha GPS satellite 1507.

In some embodiments, a DIS can be configured to use a metallic portionof an enclosure as an antenna for radiating RFID modules within theenclosure. For example, an RFID interrogator (or reader) module can beelectrically coupled to a metallic surface of the enclosure via atransmission line, and the RFID interrogator module can transmit aninterrogation (or RF) signal via the transmission line. Theinterrogation signal can be radiated from the metallic surface of theenclosure, and an interrogation response from an RFID module can bereceived at the RFID interrogator via the metallic surface andtransmission line. In some embodiments, such a configuration can be usedwith a DIS without wing assemblies or with wing assemblies that do notinclude radiators. That is, the metallic surface of the enclosure can beused as a radiator. In some embodiments, a DIS can include wingassemblies that include radiators, and the metallic surface of theenclosure can be an additional radiator used by the interrogator.

Some embodiments relate to a computer storage product with acomputer-readable medium (also referred to as a processor-readablemedium) having instructions or computer code thereon for performingvarious computer-implemented operations. The media and computer code(also referred to as code) may be those specially designed andconstructed for the specific purpose or purposes. Examples ofcomputer-readable media include, but are not limited to: magneticstorage media such as hard disks, floppy disks, and magnetic tape;optical storage media such as Compact Disc/Digital Video Discs(“CD/DVDs”), Compact Disc-Read Only Memories (“CD-ROMs”), andholographic devices; magneto-optical storage media such as opticaldisks; carrier wave signals; and hardware devices that are speciallyconfigured to store and execute program code, such asApplication-Specific Integrated Circuits (“ASICs”), Programmable LogicDevices (“PLDs”), and ROM and RAM devices. Examples of computer codeinclude, but are not limited to, micro-code or micro-instructions,machine instructions, such as produced by a compiler, and filescontaining higher-level instructions that are executed by a computerusing an interpreter. For example, an embodiment may be implementedusing Java, C++, or other object-oriented programming language anddevelopment tools. Additional examples of computer code include, but arenot limited to, control signals, encrypted code, and compressed code.

In conclusion, the present embodiment provides, among other things,methods and apparatus for a deployable RFID system. Numerous variationsand substitutions may be made in (and between) the various embodimentsdescribed herein. The uses and configurations of the various embodimentscan be modified to achieve substantially the same results as achieved bythe embodiments described herein. Accordingly, there is no intention tolimit the embodiment to the disclosed exemplary forms, and manyvariations, modifications and alternative constructions fall within thescope and spirit of the description.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, notlimitation, and various changes in form and details may be made. Anyportion of the apparatus and/or methods described herein may be combinedin any combination, except mutually exclusive combinations. Theembodiments described herein can include various combinations and/orsub-combinations of the functions, components and/or features of thedifferent embodiments described.

What is claimed is:
 1. An apparatus for monitoring one or moreradio-frequency identification (RFID) tags within an enclosure, theapparatus comprising: a first assembly comprising at least oneprocessor; at least one second assembly comprising an RFID radiatoroperatively coupled to the at least one processor, wherein the at leastone processor of the first assembly is configured to interrogate the oneor more RFID tags within the enclosure via the RFID radiator of the atleast one second assembly; and a connection element coupled to the firstassembly and the at least one second assembly; wherein the at least onesecond assembly is movable relative to the first assembly about theconnection element between an undeployed, closed configuration, in whichthe first assembly and the at least one second assembly aresubstantially parallel to each other, and a deployed, openconfiguration, in which the first assembly and the at least one secondassembly are separated from each other except through the connectionelement; and wherein the first assembly comprises a first attachmentcomponent configured to removably couple the first assembly, in thedeployed, open configuration, to at least one surface of the enclosurethat is separate from the apparatus, and wherein the at least one secondassembly comprises a second attachment component configured to removablycouple the at least one second assembly, in the deployed, openconfiguration, to at least one surface of the enclosure that is separatefrom the apparatus, such that the first assembly and the at least onesecond assembly are held in the deployed, open configuration by at leastthe coupling of their respective attachment components to the respectivesurfaces of the enclosure, so as to monitor the one or more RFID tagswithin an internal space of the enclosure.
 2. The apparatus of claim 1,wherein the connection element comprises a hinge.
 3. The apparatus ofclaim 2, wherein the hinge is a dual hinge.
 4. The apparatus of claim 1,wherein the connection element comprises a wire.
 5. The apparatus ofclaim 4, wherein the RFID radiator is communicatively connected to theat least one processor via the wire of the connection element.
 6. Theapparatus of claim 4, wherein the at least one second assemblycomprises: a backplane configured to, when the second assembly isremovably coupled to at least one external surface, be adjacent to thatat least one external surface; and a face substrate opposite thebackplane; wherein a portion of the wire of the connection element isdisposed between the backplane and the face substrate, is parallel tothe backplane and the face substrate, and electrically connects to theRFID radiator between the backplane and the face substrate.
 7. Theapparatus of claim 1, further comprising a coupler to secure the firstassembly and the at least one second assembly in the undeployed, closedconfiguration.
 8. The apparatus of claim 1, wherein one or both of thefirst attachment component and the second attachment component comprisea magnet.
 9. The apparatus of claim 8, wherein the magnet comprises arare earth magnet with a countersunk hole, and wherein the magnet isfixed to the respective assembly via the countersunk hole.
 10. Theapparatus of claim 1, comprising a plurality of second assemblies. 11.The apparatus of claim 1, wherein the processor is further configuredto: interrogate at least one of the one or more RFID tags via the RFIDradiators in two or more of the plurality of second assemblies; andreceive an interrogation response from the RFID radiators in each of thetwo or more second assemblies; and triangulate a position of the atleast one RFID tag based on the received interrogation responses. 12.The apparatus of claim 1, further comprising a locking mechanismconfigured to lock the first assembly and the at least one secondassembly in the deployed, open configuration.
 13. The apparatus of claim1, wherein the at least one second assembly comprises a fabric body. 14.The apparatus of claim 1, wherein the processor interrogates the one ormore RFID tags in response to a trigger.
 15. The apparatus of claim 14,wherein the first assembly further comprises a wireless modem, andwherein the trigger comprises reception of a command via the wirelessmodem.
 16. The apparatus of claim 14, wherein the trigger comprises anoutput from a sensor.
 17. The apparatus of claim 16, wherein the sensoris a door sensor which detects when a door is opened or closed.
 18. Theapparatus of claim 14, wherein the trigger comprises a determinationthat a location of the apparatus is within a defined geographicalregion.
 19. The apparatus of claim 1, wherein the first assembly furthercomprises a wireless modem, and wherein the processor is furtherconfigured to: receive an interrogation response from the one or moreRFID tags; generate an interrogation result based on the receivedinterrogation response; and transmit the interrogation result via thewireless modem.
 20. The apparatus of claim 1, wherein the first assemblycomprises a battery, and wherein the connection element supplies powerfrom the battery of the first assembly to the RFID radiator of the atleast one second assembly.